Anritsu and AMD Drive High-Speed Test Standardization.
(From left) Joe Tu, Associate Director of Sales and Technical Support, Anritsu Taiwan; Ivan Chen, General Manager, Anritsu Taiwan; Jack Liu, Sr. Director Product Development Eng, AMD; and Hellen Lo, Principal MTS Product Application Engineer, AMD.

Anritsu Company, Inc., a leading global provider of test and measurement solutions, held the “Next-Generation High-Speed Interface Test Seminar” on September1 at the Grand HiLai Taipei. Anritsu announced the launch of SBPC (System Board Passive Channel) Analysis Master, an automated test software developed. The solution delivers revolutionary frequency-domain and time-domain test solutions for SerDes high-speed interfaces and establishes a consistent standard for future high-speed platform testing.

Introduced for the first time, the SBPC Analysis Master software ensures highly consistent measurement results, significantly shortens the cycle between simulation and validation, accelerates R&D processes, and reduces the risks and costs associated with design verification. More importantly, it supports multiple brands of Vector Network Analyzers (VNAs), offering broad compatibility across test platforms and helping users flexibly integrate their existing test equipment.

During the seminar, Anritsu demonstrated the solution using its 4-port VectorStar™ MS4647B VNA as the platform. With up to 70 GHz bandwidth and exceptional stability, the system showcased its high-precision measurement capabilities from the frequency domain to the time domain, along with fully automated test workflows. This allowed attendees to experience first-hand the consistency and efficiency of high-speed interface testing. The live demonstration further enabled participants to directly engage with the operational workflow of SBPC Analysis Master and the MS4647B VNA, providing deeper insight into the software’s flexibility and advantages across different VNA platforms.

“In high-speed interface testing, the key is not only bandwidth and speed, but also measurement consistency. By combining the cross-platform capability of SBPC Analysis Master with the MS4647B VNA, we are taking high-speed signal testing to new levels of efficiency and precision,” said Ivy Chen, General Manager of Anritsu Taiwan. “We are delighted to collaborate with AMD, leveraging our extensive expertise in signal testing to help customers enhance performance, promote the standardization of high-speed signal testing, and deliver greater efficiency and consistency to the high-speed transmission industry.”

“Our collaboration with Anritsu underscores our confidence and commitment to establishing new global standards for high-speed platform validation,” said Jack Liu, Senior Director of Product Development at AMD. “We are excited to deploy next-generation automated consistency test solutions across AMD platforms. This will significantly improve product verification efficiency and accuracy, shorten the cycle from R&D to mass production, and drive faster adoption and broader application of next-generation high-speed technologies.”

As demand for high-speed interfaces continues to rise across AI, data centers, and high-performance computing applications, consistency and efficiency in testing have become critical to industry competitiveness. In addition to the joint demonstration with AMD showcasing the cross-platform advantage of SBPC Analysis Master and the excellent performance of the 70 GHz MS4647B VNA, the seminar also featured contributions from other industry leaders. Samtec, a leader in high-performance interconnect solutions, presented its advanced RF cable and connector technologies designed to ensure optimal signal integrity for high-speed transmission, while UL Solutions, a global leader in applied safety science, demonstrated how future testing environments can provide compliant and reliable validation for high-speed signal test solutions.