Thin Film Device Fabrication

Custom Substrate Fabrication

Vias

• Copper Plugged Vias
• Solder Resist Covered Vias

Photolithography

• Resolution down to 2um for contact aligner, 1um for 5X stepper

Sputtering

• TiW, Ti, Ta2N, Au, Pd, Nickel, etc.
• Over 30 films available

Evaporation

• Ti, Pt, Au, Pd, Ni, Ge, NiCr, etc.

Plating

• Au and AuSn

PECVD dielectric film

• Si3N4

Laser Machining

Laser Trimming

• ± 0.1%

Dicing

Photomask Layout and Design

Special Processes

• Capacitors
• Supported Bridges
• Gold-Tin Patterned Solder

Material

Design Guidelines

Thin Film Design Guidelines